In recent years, with the development of electronic products to many small, light, high density direction, especially the use of handheld equipment, components in material technology are the original SMT technology has posed a severe challenge, so that SM got rapid development opportunities. From the lC pin to 0.5mm, 0.4mm, 0.3mm development, BGA has been widely used, CSP also emerge, and showing a trend of rapid rise, the material without cleaning, low residue paste is widely used. All these have given the reflow process put forward new requirements, a general trend is for reflow using more advanced heat transfer, energy saving, uniform temperature, suitable for welding requirements of double plate PCB and new devices encapsulation, and gradually realize the complete replacement in wave soldering. Generally speaking, the reflow oven is more efficient, multi-functional and intelligent direction