8-Layers TG170 Heavy Copper ENIG PCB
Layer count: 8
Raw material： FR4 TG170 ShengYi S1141
Board thickness：1.6mm
Copper thickness：105um(3oz All)
Copper thickness in the hole barrel：25um
Min.line width/space：
Minimum hole diameter：0.2mm（Laser drill hole）
Laser number of times：Two
Laminating number of times：Three
Soldermask Ink Color：Red
Character Screen： White
Surface Finishing：Immersion gold 3u"
Application：UAV (unmanned aerial vehicle)