6-Layers TG170 Heavy Copper ENIG Board
6-Layers TG170 Heavy Copper ENIG PCB
Layer count: 6
Raw material: FR4 TG170 ShengYi S1141
Board thickness:1.6mm
Dimension:
Inner/Outer Copper thickness:70um(2oz All)
Copper thickness in the hole barrel:25um
Min.line width/space:
Minimum hole diameter:0.2mm(Laser drill hole)
Laser number of times:2
Laminating number of times:2
Soldermask Ink Color:Matte Black
Character Screen: White
Surface Finishing:Immersion gold 3u" +
Application:UAV (unmanned aerial vehicle)