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Laser Stencil For BGA Assembly

  • Laser Stencil For BGA Assembly

  • Classify：Stencil

  • Release time：2024-9-19 10:16:4

  • market price：￥0.00

  • Product profile：

    Laser Stencil For BGA Assembly

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    Hotline：0086-755-27094118
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Laser Stencil For BGA Assembly

keywords：Laser Stencil For BGA AssemblyFlytech Electronics LimitedFlytech Circuits
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•  2 Hours Rapid Quote & Engineering  
• 24 Hours Online Customer Service     
• 24 Hours for 1-2 Layers Quick Turn    
• 2-3 Days for 4-10 Layers Quick Turn  
• 4-7 Days for 12-20 Layers Quick Turn
• 5-8 Days for 22-30 Layers Quick Turn
• >8 Days for 32+ Layers Quick Turn     
   
• Up to 64 Layers Circuit Boards              
• Up to 20oz Heavy Copper Boards           
• Up to 1.5m FR4 & Aluminum LED Board
• Impedance control Tolerances ±5%      
• High Density ( HDI ) Circuit Boards         
• High-Frequency Microwave PCB            
• Rigid-Flex Circuit Boards                           
• Special Process Circuit Boards               
• FLYTECH  ELECTRONICS  LIMTED                
  Add.: Second Industry Park of XiTou,          
  SongGang Town,BaoAn District,Shenzhen 
• Phone : +86-755-27094118                            
• Fax :      +86-755-27099486                            
• Skype ID:  flytechcircuits                                
• Skype ID:  flytechpcb                                       
• E-mail: Sales@flytechcircuits.com             
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