8-Layers TG170 Heavy Copper ENIG PCB
Layer count: 8
Raw material: FR4 TG170 ShengYi S1141
Board thickness:1.6mm
Copper thickness:105um(3oz All)
Copper thickness in the hole barrel:25um
Min.line width/space:
Minimum hole diameter:0.2mm(Laser drill hole)
Laser number of times:Two
Laminating number of times:Three
Soldermask Ink Color:Red
Character Screen: White
Surface Finishing:Immersion gold 3u"
Application:UAV (unmanned aerial vehicle)