Products

Your location： Home > Products > 刚性电路板 > 厚铜板

刚性电路板

describe

8层高TG厚铜沉金板

板子层数：8层

所用板材：FR4，TG170，生益S1141

板子板厚：1.6mm

内外层铜厚：3oz

孔壁铜厚：25um

最小孔径：0.2mm（激光孔）

激光次数：2次

压合次数：3次

阻焊油墨颜色：红色

字符丝印：白色

表面处理：沉金 3u“

应用领域：无人机

Purchase

RealName：

Telephone：

Email：

Content：

*
Please fillPurchaseThe number of products and product description, convenient for us to carry out uniform stocking。

Code：

Change a

Recommend

Product reviews

review

Content：

Code：

Change a

• 2 Hours Rapid Quote & Engineering • 24 Hours Online Customer Service • 24 Hours for 1-2 Layers Quick Turn • 2-3 Days for 4-10 Layers Quick Turn • 4-7 Days for 12-20 Layers Quick Turn • 5-8 Days for 22-30 Layers Quick Turn • >8 Days for 32+ Layers Quick Turn	• Up to 64 Layers Circuit Boards • Up to 20oz Heavy Copper Boards • Up to 1.5m FR4 & Aluminum LED Board • Impedance control Tolerances ±5% • High Density ( HDI ) Circuit Boards • High-Frequency Microwave PCB • Rigid-Flex Circuit Boards • Special Process Circuit Boards	• FLYTECH ELECTRONICS LIMTED Add.: Second Industry Park of XiTou, SongGang Town,BaoAn District,Shenzhen • Phone : +86-755-27094118 • Fax : +86-755-27099486 • Skype ID: flytechcircuits • Skype ID: flytechpcb • E-mail: Sales@flytechcircuits.com
FLYTECH ELECTRONICS LIMITED Copyright © 1999-2019 www.flytechcircuits.com All Rights Reserved